Hanwha, SK hynix develop core chip packaging equipment
Sept 21, 2020
Hanwha Precision Machinery Co., a major assembly automation equipment maker in South Korea, said Monday it has developed core semiconductor packaging equipment in collaboration with the country's No. 2 chipmaker SK hynix Inc. Hanwha Precision and SK hynix worked together to commercialize the die bonder, a machine that attaches a semiconductor die to a package, such as a printed circuit board in the back-end chip packaging process. Hanwha Precision Machinery said its die bonder has better mate